Semiconductor
Materials,
PCB/FPC
Materials and
Electronics
Components
Materials Business
Kanematsu offers various materials related to semiconductors, PCB/FPC and electronics components, in order to respond to the diverse needs of customers. These materials are used for each process of the front-end and back-end processes of semiconductors, and PCB/FPC manufacturing.
We will continue to contribute to solving the issues of customers utilizing our experience cultivated over many years, and the global network.
Business Features
Sales network mainly located in the Asian region
In addition to Taiwan the center of semiconductor production, and the world's factory China, we have constructed a sales network in the ASEAN region, where plant construction has been advancing rapidly the past several years, so that we can perform sales activities in locations close to the customers.
Business focus areas
①Semiconductor materials: We make proposals for auxiliary materials for testing and related equipment, etc., in addition to the wafer deposition material (metal and oxide), front-end process materials including CMP slurry, etc., and back-end process materials, such as die attach materials and bonding wire, etc.
②Board materials: We make proposals for materials used in each process, such as CCL/FCCL, materials for patterning process and surface treatment chemicals, auxiliary materials including cushion materials for pressing and related equipment, etc.
③Electronics components materials: We make proposals for raw materials of electronics components, such as connectors, MLCC and inductors, and equipment used for each manufacturing process.
Exhibition
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closed
Wednesday, March 20, 2024 - Friday, March 22, 2024
- Location
- Shanghai New International Expo Centre
- Exhibition booth
- T1313
- Target
- Semiconductor manufacturing (Foundry, OSAT, etc), Plating technology, Compound semiconductor
- We’ll jointly exhibit at SEMICON China 2024 with JAPAN PURE CHEMICAL CO., LTD., a top plating chemical manufacturer.
- We introduce non-cyanide gold plating technology used for compound semiconductor (GaN), and gold plating bump technology for LCD driver ICs.
- We will also exhibit high-performance plating technology for advanced semiconductor which is usable for chiplet and RDL application.
Contact Us
If you wish to request materials or obtain detailed information about our products and services, please use the contact form.
