& Material Dept.

Kanematsu handles a wide range of components and materials related to electronics including materials for secondary batteries, in addition to surface treatment chemicals and equipment for semiconductors, PCBs and connectors, various types of optical lenses, and components for augmented reality (AR) and virtual reality (VR).
We promptly deliver high performance and environmentally friendly materials, made by overseas manufacturers through our global network, not only manufacturers in Japan.

Business Features

Global support system and technical knowledge

Representatives are widely assigned to overseas bases of the Kanematsu Group, particularly in the Asian region, where we have constructed local support systems with fully experienced personnel. The support provided by personnel who are familiar with the local conditions will be useful for customers.

Extensive product lineup

Kanematsu proudly offers an extensive product lineup obtained through the handling of surface treatment chemicals, optical components, and secondary battery components over many years. As a new activity, we also actively introduce overseas startup companies to the Japanese market.

Main products and services

Surface Treatment Chemicals Business

Kanematsu offers a wide range of products including plating chemicals (precious metals included) used for the manufacturing of printed circuit boards (PCBs, FPCs, package substrates), semiconductors and connectors, etc., surface treatment chemicals such as pre-treatment and post-treatment agents, surface treatment related equipment, materials for surface treatment, and raw materials for chemical products, and the business is expanding globally making full use of the sales offices located around the world and the distribution network.

Semiconductor Materials, PCB/FPC Materials and Electronics Components Materials Business

We offer various materials related to semiconductors, PCB/FPC and electronics components, in order to respond to the diverse needs of customers. These materials are used for each process of the front-end and back-end processes of semiconductors, and PCB/FPC manufacturing.

Battery & Energy Business

Not only materials for lithium ion battery cells and packages, but we can also make proposals for materials focusing on state-of-the-art technologies for solid-state batteries, fuel cells, and hydrogen generation by water electrolysis, etc.

Optical Components, Optical Materials & Optical Communication Related Components Business

Kanematsu offers an extensive range of products, such as parts for lens units and lenses (plastic lenses, glass lenses) for projectors, optical coating materials, spectrum light mirrors for cinemas, and optical communication related components, and the business has expanded around the world.

Autonomous Mobile Robots (AGV & AMR) Business

Kanematsu handles and provides introductory support of high performance Autonomous Mobile Robots (AMR), and makes proposals for products suitable for distribution and manufacturing sites, such as transfer robots, automatic forklifts, serving robots, and cleaning robots, etc., as well as solutions.

AR/VR Glasses Components & Equipment Business

Kanematsu offers products, such as optical waveguide type AR glasses, reflective type holographic glass manufacturing equipment (wire saws) for AR glasses, coating agents, polishing compounds, coolants, and laser light sources, etc., and provides support to realize state-of-the-art technology.


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    Wednesday, March 20, 2024 - Friday, March 22, 2024

    Shanghai New International Expo Centre
    Exhibition booth
    Semiconductor manufacturing (Foundry, OSAT, etc), Plating technology, Compound semiconductor
    • We’ll jointly exhibit at SEMICON China 2024 with JAPAN PURE CHEMICAL CO., LTD., a top plating chemical manufacturer.
    • We introduce non-cyanide gold plating technology used for compound semiconductor (GaN), and gold plating bump technology for LCD driver ICs.
    • We will also exhibit high-performance plating technology for advanced semiconductor which is usable for chiplet and RDL application.