Kanematsu Corporation will exhibit at “Compound Semiconductor Week 2026,” to be held from Sunday, May 24 to Thursday, May 28, 2026, at Kumamoto-jo Hall in Kumamoto, Japan. At our booth(No.15), we will introduce MOCVD system manufactured by Nippon Sanso Corporation, ECR Plasma Sputtering System manufactured by JSW Afty Co., Ltd, and Grinder/Polisher by Okamoto Machine Tool Works, Ltd.
For detailed information regarding the conference schedule and venue, please refer to the official event website.
Compound Semiconductor Week 2026（CSW2026）
Dates：May 24 (Sun) – 28 (Thu), 2026
Venue：Kumamoto-jo Hall, Kumamoto City, Kumamoto Prefecture, Japan
Our Booth No.: 15
Official Website：https://csw-jpn.org/
＜Attendance Information＞
Advance registration (paid) is required to participate in this event. Registered participants will have access to the international conferences, technical sessions, and exhibition area related to the compound semiconductor field. For details on registration fees and categories, please refer to the registration page below.
Registration Page：Registration - Compound Semiconductor Week 2026Compound Semiconductor Week 2026
Kanematsu will primarily showcase the following equipment that supports compound semiconductor manufacturing process.
・MOCVD system manufactured by Nippon Sanso Corporation
・ECR Plasma Sputtering System manufactured by JSW Afty Co., Ltd
・Grinder/Polisher manufactured by Okamoto Machine Tool Works, Ltd.
We look forward to welcoming you to our booth.
【Media Contact】
Semiconductor Equipment Department Section 1
E-mail：TDH1@kanematsu.co.jp