Kanematsu Corporation will exhibit at “International Semiconductor Laser Conference (ISLC) 2026,” to be held from Sunday, June 14 to Wednesday, June 17, 2026, at Tampere Hall in Tampere, Finland.
At our booth, we will showcase various manufacturing equipment for compound semiconductors, including MOCVD system manufactured by Nippon Sanso Corporation, ECR Plasma Sputtering Systems manufactured by JSW Afty Co., Ltd, Grinder/Polishers manufactured by Okamoto Machine Tool Works, Ltd., and equipment manufactured by Opto System Co., Ltd.
< Registration Information>
For detailed information regarding the conference schedule and venue, please refer to the official event website.
International Semiconductor Laser Conference (ISLC) 2026
Dates：June 14(Sun) – 17(Wed), 2026
Venue：Tampere Hall, Tampere, Finland
Official Website： https://events.tuni.fi/islc2026/
＜Attendance Information＞
Advance registration (paid) is required to participate in this event. The registration fees include the conference program, lunch and refreshments, the City of Tampere reception, and the conference banquet. For details on registration fees and categories, please refer to the registration page below. Registration Page：https://events.tuni.fi/islc2026/registration/
Kanematsu will primarily showcase the following equipment that supports compound semiconductor manufacturing processes.
・MOCVD system manufactured by Nippon Sanso Corporation
・ECR Plasma Sputtering System manufactured by JSW Afty Co., Ltd
・Grinder/Polisher manufactured by Okamoto Machine Tool Works, Ltd.
・Laser Scriber/Braker, LD Bar Stacker and Tester by Opto System Co.,Ltd.
We look forward to welcoming you to our booth.
【Media Contact】
Semiconductor Equipment Department, Section 1
Kanematsu Corporation
E-mail：TDH1@kanematsu.co.jp